This report examines the thermal performance of air-cooled and water-cooled heat sink designs for a 75 W heat load. Air-cooled systems analyzed include straight fin and pin fin configurations. Version 2 (100 mm × 100 mm base) outperformed Version 1 (50 mm × 50 mm base) in terms of heat dissipation and temperature uniformity. The straight fin design achieved lower surface temperatures and reduced pressure drops compared to the pin fin configuration. Python-based calculations validated by ANSYS simulations confirmed the advantages of straight fins, while water cooling demonstrated promise but faced challenges related to boundary condition setup and geometry simulation. These findings underscore the critical role of design optimization in practical cooling applications, particularly for high-performance electronics such as microprocessors. The report further emphasizes the application of fundamental heat transfer principles, leveraging simulation tools for design evaluation, and critically assessing performance outcomes to achieve practical and efficient thermal management solutions.
The design and analysis of heat sinks play a critical role in ensuring efficient thermal management for high-performance electronics. This project focuses on optimizing a heat sink design to effectively dissipate a heat load of 75 W using external forced convection principles and simulation tools to evaluate performance. The challenge lies in achieving an optimal balance between thermal efficiency, manufacturability, and operational cost while adhering to provided design constraints. Two iterations of heat sink designs were developed and analyzed using ANSYS simulation software. The first design served as an initial baseline but had limitations in thermal performance. The second iteration introduced key geometric optimizations, such as increased surface area and improved fin spacing, which demonstrated significant enhancements in heat dissipation capability. The report evaluates temperature and heat flux distributions under varying convection coefficients and discusses practical implications, highlighting recommendations for further optimization and refinement of the designed heat sink.
The design process of the heat sink involved a series of iterative enhancements aimed at optimizing thermal performance, manufacturability, and cost-effectiveness. Each iteration addressed key limitations discovered through analytical calculations, Python simulations, and ANSYS-based thermal analysis. This section discusses the two primary iterations—Version 1 and Version 2—highlighting the design evolution, key modifications, and performance improvements achieved.
Version 1 served as the baseline for evaluating thermal performance. This iteration featured two distinct configurations fabricated from aluminum alloy 6061 due to its high thermal conductivity:
Under forced convection conditions at 10 W/m²·°C and 150 W/m²·°C, Version 1 exhibited the following characteristics:
Key limitations identified in Version 1 included:
Figure 1 & 2: Thermal flux for Version 1 (Pin and Straight Fin) under forced convection at 10 W/m²·°C.
Version 2 introduced substantial design enhancements based on the findings from Version 1. Key modifications included:
The enhancements in Version 2 resulted in significant performance gains:
Figure 3 & 4: Heat flux for Version 2 (Pin and Straight Fin) under high convection conditions (150 W/m²·°C).
Metric | Version 1 (Straight Fin) | Version 1 (Pin Fin) | Version 2 (Straight Fin) | Version 2 (Pin Fin) |
---|---|---|---|---|
Base Dimensions (mm) | 50 × 50 | 50 × 50 | 100 × 100 | 100 × 100 |
Max Temperature (°C) | 41 | 43 | 30.7 | 33.2 |
Heat Transfer (W) | 136.50 | 68.13 | 535.50 | 303.66 |
Reynolds Number | 2065.48 | 2065.48 | 526.40 | 526.40 |
Table 1: Performance comparison between Versions 1 and 2 under high convection conditions.
The iterative design process highlighted the critical role of base area, fin geometry, and airflow management in optimizing thermal performance. Version 2's straight fin design emerged as the most effective configuration, offering uniform temperature distribution, reduced pressure drops, and superior heat dissipation. These improvements underline the importance of design optimization in achieving efficient thermal management solutions for high-power electronic applications.
The analytical calculations in this project were conducted to determine the thermal performance of the heat sink designs. Using fundamental heat transfer principles, the calculations focused on estimating key parameters such as heat dissipation, Reynolds number, airflow velocity, and pressure drop. These parameters provided a benchmark for validating simulation results and evaluating design effectiveness.
The primary equation used to calculate the heat transfer rate (Q) is:
Q = h × A × (T_surface − T_ambient)
Where:
The Reynolds number (Re) determines the flow regime (laminar or turbulent):
Re = (ρ × v × D) / μ
Where:
For the rectangular fin design:
D = 4A / P
Result: D = 4.88 × 10⁻³ m
Assuming v = 2 m/s:
Re = (1.225 × 2 × 4.88 × 10⁻³) / (1.81 × 10⁻⁵) = 660 (Laminar Flow)
Using the Dittus-Boelter correlation:
h = 10.45 + 10√v
Example Calculation: Assuming v = 2 m/s, h = 24.57 W/(m²·K).
v = ((Q / (h × A × ΔT)) − 10.45)²
Result: v = 2.02 m/s (Sufficient for cooling requirements).
Configuration | Surface Area (m²) | Heat Transfer (W) | Max Temperature (°C) | Reynolds Number | Flow Type |
---|---|---|---|---|---|
Version 1 - Straight Fins | 0.0260 | 9.10 | 41.0 | 2065.48 | Laminar |
Version 1 - Pin Fins | 0.0130 | 4.54 | 43.0 | 2065.48 | Laminar |
Version 2 - Straight Fins | 0.1020 | 535.50 | 30.7 | 526.40 | Laminar |
Version 2 - Pin Fins | 0.0578 | 303.66 | 33.2 | 526.40 | Laminar |
Table 1: Analytical results comparing surface area, heat transfer, temperature, and flow characteristics for both versions.
The analytical calculations confirmed that Version 2's straight fin design is the most thermally efficient configuration, achieving high heat dissipation rates with minimal airflow requirements. The analytical results aligned closely with simulation data, validating the reliability of the design modifications.
This study analyzed air-cooled and water-cooled heat sink designs for a 75 W heat load, employing analytical calculations, Python-based simulations, and ANSYS Workbench validation. The Version 2 straight fin heat sink emerged as the most effective configuration, demonstrating superior thermal performance and operational efficiency.
Key Findings:
While the Version 2 straight fin heat sink met the primary performance goals, further enhancements are suggested for broader applications:
Investigate alternative materials such as copper or composite alloys to improve thermal conductivity and reduce temperature gradients.
Refine water block geometries and address simulation challenges related to boundary conditions and complex fluid paths. Experimental validation is recommended to assess practical performance.
Optimize fan placement and implement variable speed controls to enhance airflow management and reduce energy consumption.
Explore alternative fin geometries, such as louvered or wavy fins, to enhance turbulence and improve convective heat transfer.
Construct physical prototypes for empirical testing, providing real-world data to refine simulation models and design assumptions.
Evaluate the performance of the heat sink design under higher power loads and varied form factors to ensure applicability across diverse electronic systems.
The Version 2 straight fin design offers an efficient and scalable solution for thermal management in high-performance electronics. Future research should focus on material enhancements, airflow optimization, and advanced water-cooling integration to further improve performance and adaptability.